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Kaneka Plans to Expand Production Capacity for Ultra-heat-resistant Polyimide Film, ApicalTM
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In recent years, the demand for flexible printed circuit used in cellular phones
and PCs has grown significantly. In April 2003, Kaneka announced that it could
expand its production capabilities for ultra-heat-resistant polyimide film,
ApicalTM, at the Shiga Plant. Currently, the annual production of ApicalTM
is 1,200 tons at the Shiga Plant, and 200 tons at Kaneka High-Tech Materials
Inc., U.S.A., for a total of 1,400 tons.
In spring 2004, the annual production capacity at the Shiga Plant will be
increased to 1,800 tons, bringing the total capacity, including production in
the U.S.A., to 2,000 tons per year.
The expanded facility will be mainly used for the production of Apical NPI, a
product with enhanced high-dimensional stability. In addition, Kaneka will
aggressively expand sales efforts for Apical HP, and Pixeo BP, used in
two-layer flexible copper clad laminates, which has been a rapidly growing
market in recent years. Furthermore, Kaneka is currently developing additional
products, such as new polyimide materials, to offer a more comprehensive product
line.
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