Thermosetting /photo-curable resins, photosensitive resins
This is a material that combines the strength and adhesiveness derived from organic components with the heat resistance and transparency derived from silicone components.
Various physical properties (viscosity, curing speed, adhesiveness) can also be tuned according to your request.
A photosensitive material with high heat resistance and low dielectric constant that can be used for photolithography.
High transparency in the short wavelength region enables①shorter irradiation time (high sensitivity) and②thicker films.
For thin film applications, it is used as a permanent insulating film for flat panel displays, and for thick film applications, it is used as a barrier material for flat panel displays and sensors. There are two types of photosensitive materials (photoresists): negative and positive.
Features
-
High transparency:
Transmits light in a wide wavelength range (400-1100nm) -
Low dielectric constant
(Dk< 3 @ 1MHz) -
Heat and light resistance
Reflow resistance - Maintains transparency for a long time, even in harsh environments with high heat or strong light → Provides the higher durability of the devices
-
Moisture and heat resistance / Wet heat resistance
Good gas barrier property → Protects the device from humidity and moisture -
High adhesiveness
Maintains initial adhesive strength even after various reliablity tests → Improves device reliability -
Less outgassing
Cured products have less outgassing during vacuum heating deposition processes → Reduces defects due to device contamination -
Processability
Thermosetting /photo-curable type, photosensitive type
Characteristic
| Item | Unit | Heat/light curing resins | ||
|---|---|---|---|---|
| Grade F | Grade P | |||
| Viscosity（@23℃） | Pa・s | 0.4 | 1.1 | |
| Transmittance（@400nm,2mmt） | % | 91 | 91 | |
| Hardness（@23℃） | Shore D | 86 | 59 | |
| Tensile elasticity | 23℃ | MPa | 2000 | 1200 |
| 120℃ | MPa | 800 | 4 | |
| Refractive index（@25℃,nD） | ― | 1.5 | 1.5 | |
but the typical measurement values at our company.
| Item | Unit | Photosensitive resin | |
|---|---|---|---|
| Standard | Thick film | ||
| Target film thickness | μm | 0.5～10 | 20～250 |
| Transmittance（@400nm） | % | 98 | 98/86* |
| Permittivity（@1MHz） | ― | 2.7 | 3.0 |
| Refractive index（@25℃,nD） | ― | 1.5 | 1.5 |
（50μm thick）
These data are not guaranteed values but the typical measurement values at our company.
Applications
Applications: Adhesives (prisms, sensors), coating agents (insulating films), encapsulants (LED, Blu-Ray), imprints (lenses, anti-reflection layers)
Applications: Coating type insulating film (displays) / photolithography (displays, sensors)