Features
Cover coat ink is ideal for circuit pattern protection and insulation of flexible printed circuit boards as it has good photo seneitivity and patterning dimensional control by exposing to ultraviolet rays.
- Can be used in place of existing coverlay films
- Good low spring-back property
- Enables simplification of the manufacturing process of circuit boards
- Possible to propose the optimal coating method for each application
Examples of Use
It can be used in place of existing coverlay films for circuit pattern protection and insulation of flexible printed circuit boards used in smartphone displays, which require low spring-back property.
Low spring-back property
Good low spring-back property even after heating in the component mounting process
When using cover coat ink
When coverlay film is used
spring-back property
Lower spring-back property than coverlay film.
Simplification of circuit board manufacturing process
Manufacturing process of cover coat ink
Existing manufacturing process
and cover coat ink