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Information and Communication Materials Super Heat-resistant Polyimide Film

Product name

Super Heat-resistant Polyimide Film
Super Heat-resistant Polyimide Film

PIXEO™

PIXEO™ is a polyimide film with a TPI (thermoplastic polyimide) layer developed for 2-layer flexible circuit boards. Because it is an all-polyimide material that does not require epoxy-based adhesives, it enables copper foil to be attached directly by thermal lamination, which contributes to the promotion of high heat resistance and thinner circuit boards and is widely used in portable electronic devices such as smartphones and tablets.

2-layer flexible circuit boards

Characteristic

Item Unit Grade Measurement method
FRS
Film properties Tensile modulus GPa 5.3 IPC-TM-650 2.4.18.3
Tensile strength MPa 190 IPC-TM-650 2.4.19
Elongation at Break ー 80 IPC-TM-650 2.4.19
Dielectric Constant＠1MHz ー 3.4 Kaneka method
Dielectric loss tangent＠1MHz ー 0.01 Kaneka method
Volume resistivity Ω・cm >1015 IPC-TM-650 2.5.17
Surface resistivity Ω >1016 IPC-TM-650 2.5.17
Glass transition temperature Tg ℃ 290 IPC-TM-650 2.4.24.4
Coefficient of Thermal Expantion (100-200℃） ppm/℃ 18 IPC-TM-650 2.4.41.3
Moisture absorption % 1 Kaneka method
Flammability ー V-0,VTM-0 UL94
Properties of 2-layer double-sided FCCL using PIXEO Dimensional Stability
MD/TD		 After etching % -0.02/-0.02 IPC-TM-650 2.2.4
After heating -0.01/-0.01
Peeling Strength Normal N/cm 17 IPC-TM-650 2.4.9
After soldering
Solder Resistance Normal ー 350℃/60sec No swelling IPC-TM-650 2.4.13
After moisture absorption ー 300℃/60sec No swelling
These data are not guaranteed values but the typical measurement values at our company.

Applications

  • Flexible copper clad laminated sheets

Related Sites

  • Shiga Manufacturing Site
    Location: Otsu-shi, Shiga, Japan

PIXEO for high frequency applications

This product exhibits good transmission loss characteristics, enabling higher frequencies and speeds for 5G-compatible smartphones.
As with the existing PIXEO, it is made of all-polyimide material and can be thermally laminated.

Characteristic

Item Unit Grade Measurement method
IB
Film properties Tensile modulus GPa 7.6 IPC-TM-650 2.4.18.3
Tensile strength MPa 280 IPC-TM-650 2.4.19
Elongation at Break % 80 IPC-TM-650 2.4.19
Dielectric Constant＠10GHz ー 3.4 Kaneka method
Dielectric loss tangent＠10GHz ー 0.0025 Kaneka method
Volume resistivity Ω・cm >1015 IPC-TM-650 2.5.17
Surface resistivity Ω >1016 IPC-TM-650 2.5.17
Glass transition temperature Tg ℃ 210 IPC-TM-650 2.4 24.4
Coefficient of Thermal Expantion (100-200℃） ppm/℃ 18 IPC-TM-650 2.4 41.3
Moisture absorption % 0.4 Kaneka method
Flammability ー V-0,VTM-0 UL94
Properties of 2-layer double-sided FCCL using PIXEO Dimensional Stability
MD/TD		 After etching % 0.00/0.02 IPC-TM-650-2.2.4
After heating 0.01/0.02
Peeling Strength Normal N/cm 15 IPC-TM-650-2.4.9
After soldering
Solder Resistance Normal ー 350℃/60sec No swelling IPC-TM-650 2.4.13
After moisture absorption ー 300℃/60sec No swelling
These data are not guaranteed values but the typical measurement values at our company.

Transmission Loss - Film Thickness 50um -

Using our proprietary polyimide resin design technology, we have developed a polyimide film with good dielectric properties.
PIXEO for High Frequencies can reduce transmission loss in the high frequency and high-speed transmission frequency bands.
Transmission Loss - Film Thickness 50um -

Related Sites

  • Shiga Manufacturing Site
    Location: Otsu-shi, Shiga, Japan

APICAL™

APICAL™ is a polyimide film developed through research based on our extensive polymer technology expertise and is used as a material for flexible printed circuit boards, raw material for graphite sheets, and wire coating materials for aircraft, motors, and power generators, etc…

APICAL

Features

  • Good flame retardance (V-0, VTM-0)
  • Good chemical resistance
  • Good dimensional stability (low coefficient of linear expansion nearly equivalent to copper in the temperature range of 100-200°C)
  • Isotropically controlled properties

Characteristic

Item Unit Grade Measurement method
NPI
Tensile modulus GPa 4.1 IPC-TM-650 2.4.18.3
Tensile strength MPa 300 IPC-TM-650 2.4.19
Elongation at Break % 75 IPC-TM-650 2.4.19
Coefficient of Thermal Expantion (100-200℃） ppm/℃ 16 IPC-TM-650 2.4 41.3
Heating shrinkage MD ％ 0.08 200℃、2hr
IPC-TM-650 2.2.4 Method A
TD 0.02
Water absorption ％ 2.8 IPC-TM-650 2.6.2
Dielectric Constant＠1MHz ー 3.3 IPC-TM-650 2.5.5.3
Volume resistivity Ω・cm >1015 IPC-TM-650 2.5.17
Dielectric Strength kV 8(25μm thick) ASTM D149、60Hz、20℃
Glass transition temperature Tg ℃ Nil Dynamic thermo-mechanical analysis
Flammability ー V-0,VTM-0 UL94
UL temperature rating (Mechanical) ℃ 200 UL746B
UL temperature rating (Electrical) ℃ 240 UL746B
These data are not guaranteed values but the typical measurement values at our company.

Applications

  • Flexible copper clad laminated sheets
  • Graphite sheets
  • Coverlay films
  • FPC reinforcement plates
  • Heat-resistant protective films
  • Aircraft wire coating materials
  • Wire coating materials for motors and generators

Related Sites

【Precautions for Use】

The above mentioned product is intended for non-food applications.
Please inform us what the application is in advance so to ensure the best possible technical support regarding safety.
The information contained herein is based on materials, information and data available at this time and is subject to revision based on new findings.
In addition, the precautions listed are intended for normal handling, and if special handling is required, please take specific safety precautions apt for your application and usage.
The information contained herein is provided for informational purposes only and is not guaranteed.